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Characteristics

Characteristics

Liquid Wax provides temporary adhesion, enabling workpieces to bond to the process substrate, facilitating high-precision and high-strength operations such as polishing, grinding, and wafer thinning.


Application

  • Suitable Industries
    Silicon wafer semiconductor, compound semiconductor (SiC/GaN/InP/GaAs), other industrial processing applications.
  • Suitable Processes
    Grinding/Polishing/Thinning/Cutting etc.
  • Equipment Requirements
    Recommended to use with a spin coater for waxing.


Features

  1. Stable Quality: Utilizes chemically synthesized resin as the main component, ensuring consistent material properties and resolving the quality variation issues associated with natural rosin due to seasonal, regional, and growth process differences.
  2. Customizable Properties: The molecular structure of the synthetic resin can be designed according to customer process conditions, providing suitable adhesive wax properties to meet process requirements.
  3. High Viscosity Adjustability: Allows for high variability in viscosity, achieving the desired film thickness by adjusting the composite formula and spin coater parameters.
  4. Water-Soluble: The synthetic resin product has good water solubility, allowing for easy cleaning with water without the need for additional solvents such as IPA.




Specification


Item No.AppearanceSolids contentPhViscosity (R/T)Softening point
GSW3 Light yellow liquid 40% 9~10 200 cp 90~95℃
   

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