Characteristics
Liquid Wax provides temporary adhesion, enabling workpieces to bond to the process substrate, facilitating high-precision and high-strength operations such as polishing, grinding, and wafer thinning.
Application
Total : 0
Specialty Chemicals
Liquid Wax
Characteristics
- Suitable Industries ：
Silicon wafer semiconductor, compound semiconductor (SiC/GaN/InP/GaAs), other industrial processing applications. - Suitable Processes ：
Grinding/Polishing/Thinning/Cutting etc. - Equipment Requirements ：
Recommended to use with a spin coater for waxing.
Features
- Stable Quality: Utilizes chemically synthesized resin as the main component, ensuring consistent material properties and resolving the quality variation issues associated with natural rosin due to seasonal, regional, and growth process differences.
- Customizable Properties: The molecular structure of the synthetic resin can be designed according to customer process conditions, providing suitable adhesive wax properties to meet process requirements.
- High Viscosity Adjustability: Allows for high variability in viscosity, achieving the desired film thickness by adjusting the composite formula and spin coater parameters.
- Water-Soluble: The synthetic resin product has good water solubility, allowing for easy cleaning with water without the need for additional solvents such as IPA.
Specification
| Item No. | Appearance | Solids content | Ph | Viscosity (R/T) | Softening point |
|---|---|---|---|---|---|
| GSW3 | Light yellow liquid | 40% | 9~10 | 200 cp | 90~95℃ |
